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Silicone PC

Polycarbonate (PC)

Technical Specifications

  • Excellent Low-Temp Impact
  • Scratch Resistance
  • Superior Weatherability

Applications

Phone HousingsCharger HousingsOutdoor EquipmentAutomotive InteriorMedical Devices

Technical Data Sheet (TDS)

PropertyTypical Value
Density1.18 - 1.20 g/cm³
Melt Flow Rate (MFR)5 - 15 (300°C/1.2kg) g/10min
Tensile Strength55 - 65 MPa
Elongation at Break80 - 120 %
Flexural Modulus2100 - 2300 MPa
Izod Impact Strength50 - 70 kJ/m²
Heat Deflection Temperature (HDT)120 - 130 (1.82MPa) °C
AppearanceTransparent / Translucent Pellets

The above data are typical values and do not constitute a specification guarantee. Please contact us for the latest product datasheet.

Processing Conditions

Drying Temperature

120°C

Drying Time

4 - 6 hours

Injection Temperature

270 - 310°C

Mold Temperature

80 - 120°C

Injection Pressure

80 - 140 MPa

Holding Pressure

50 - 90 MPa

Back Pressure

3 - 10 MPa

Screw Speed

40 - 70 rpm

Important Notes
  • Moisture must be ≤ 0.02% before molding
  • Use desiccant dryer

Storage & Handling

PC is extremely moisture-sensitive. Must use desiccant dryer. Store sealed. Excessive moisture causes silver streaking and bubbles in molded parts.